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Cleanroom · Manual loading and automatic bundling | 304 stainless steel body · Compatible with JEDEC standard material tray
1、 Product Features
The IC tray stainless steel automatic strapping machine is used for bundling and packaging of IC tray stacking: the stacked trays are manually placed into the workstation and positioned, and the machine automatically completes the feeding, tightening, hot melt bonding, and cutting of the tape after foot operation, with a speed of 1.9 seconds per pass. After manual removal, the next tray can be entered.
This machine is a customized model for IC tray electronic workshop: the frame is made of 304 stainless steel and can be wiped; Embedded touch screen control on the workbench, with force, hot head temperature, and number of passes directly set on site; It can also be paired with an intelligent fully automatic packaging assembly line for bundling.
The strapping position is designed according to the JEDEC standard tray packaging groove - there are a total of 3 strapping grooves on both sides and the middle of the standard material tray, combined with single, double, and grass shaped grooves. The bundling position of the same batch of trays is unified, without pressing grooves or damaging chips.
The workflow is as follows: manually place the stacked tray into the workstation → set the force and belt type on the touch screen of the table → start with foot pedal → automatically feed and tighten the belt to the set force → hot melt adhesive, cut the belt → manually remove → cycle to the next plate.
2、 Product parameters
项目 | 参数 |
型号 | QYGC-500*400 A 款（平板台） |
机身材质 | 304 不锈钢机架（IC 托盘电子车间定制） |
整机尺寸 | L750 × W590 × H1340 mm |
电源 | 220V 50HZ |
捆扎尺寸 | 宽度 50-450mm，高度 50-380mm |
台面高度 | 790-850mm 高度可任意调节（可非标定制） |
面板承重 | 50Kg |
捆扎速度 | 1.9 秒/道 |
捆扎方式 | 脚踏、手动 |
捆扎力度 | 1-9 档可调节 |
扎带规格 | PP 打包带，带宽 12mm |
扎带厚度 | 0.6-1.0mm |
附加功能 | 具备打包计数功能、烫头温度恒温可调节 |
控制系统 | 定制 PLC 控制板 + 施耐德继电器，工作台面嵌入式触摸屏控制 |
驱动系统 | 机芯 2 套伺服电机：M1 热熔剪切压紧、M2 送带拉带紧带 |
捆扎对象 | IC 托盘（JEDEC 标准料盘，两侧 + 中部 3 个打包槽） |
上料方式 | 人工上料定位，机器自动捆扎 |
▲ QYGC-500 * 400 A (flat table) IC tray automatic strapping machine, complete machine shot
3、 Data comparison
项目 | 人工缠胶带 VS 本机自动捆扎 | |
捆扎速度 | 人工缠胶带，一盘约 30 秒 | 1.9 秒/道，脚踏启动 |
道数位置 | 每人手法不一，位置漂移 | 按打包槽打带，道数位置统一 |
力度控制 | 手感控制，紧了压伤托盘、松了散盘 | 1-9 档可调，烫头恒温 |
托盘洁净 | 胶带残胶沾灰，料盘二次污染 | 热熔粘接无残胶，不锈钢机身可擦拭 |
托盘回收 | 残胶难清理，影响周转 | 清洗后可循环使用 |
描述 | 1. 胶带缠得慢，批量出货卡包装节拍 | 1. 人工上料、脚踏启动， 1.9 秒/道 |
4、 Product Features
1. Specially customized for IC tray electronic workshop: The rack is made of 304 stainless steel, can be wiped, and is suitable for dust-free workshop packaging sections.
2. Manual feeding, foot pedal start, machine automatic belt feeding, tightening, hot melt bonding, cutting, 1.9 seconds per pass.
3. The workbench is equipped with an embedded touch screen control, a 12mm wide PP strap, adjustable strength levels from 1 to 9, a constant temperature for the hot stamping head, and a packing counting function.
4. The belt position is designed with three packaging slots according to JEDEC standard tray, single/double/grass combination; Adjustable strength, suitable for 23 ± 2kg tape testing, without crushing material trays with a curvature of ≤ 0.3mm.
5. Hot melt adhesive has no residual glue, and the tray can be recycled after cleaning without causing secondary pollution to the material tray.
6. Customized PLC control board+Schneider relay, with 2 sets of servo motor drives for the movement (M1 hot melt shearing and pressing, M2 belt feeding and pulling), stable operation, and can be matched with intelligent fully automatic packaging assembly line bundling.
5、 Compliant with standards
Tray standard: JEDEC tray specification - total thickness 7.62mm, 3 packaging slots on both sides and the middle, tape test 23 ± 2kg tension, flexural strength ≥ 10kg/30 seconds
Anti static: The surface resistance of the IC tray is 10 ⁹ -10 ¹¹ Ω (industrial grade anti-static); Workshop ESD management can refer to ANSI/ESD S20.20 and IEC 61340-5-1
Clean environment: For dust-free workshops, reference can be made to ISO 14644 and GB 50073-2013 "Code for Design of Cleanrooms"; Stainless steel body can be wiped, suitable for packaging sections of 10000/100000
6、 Applicable scenarios
The packaging section of finished and semi-finished material trays in chip packaging factories (BGA, QFN, QFP, TSOP and other packaging forms); IC tray cleaning, recycling, and turnover line; Semiconductor warehousing and shipping packaging station. Suitable for groove matrix 10 × 10~20 × 20 (100-400 grooves) standard material tray, covering carrier specifications from 3 × 3mm micro sensors to 22 × 22mm large power chips.
