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11Semiconductor tray horizontal, vertical, and automatic bundling solution | Compatible with JEDEC standard tray
1、 Product Features
The IC tray specific strapping machine is used for automatic strapping of semiconductor IC trays (JEDEC trays) before shipment, replacing manual tape wrapping and general semi-automatic strapping machines. The equipment consists of a gantry frame, a bundling machine head, a touch screen control system, a dust removal and suction system, and a universal caster base.
The workflow is as follows: Place the stacked IC trays on the table for positioning → Select the bundling program on the touch screen (two horizontally and one vertically) → Automatic tape feeding and tightening to the set tension under the gantry → Hot melt bonding, tape cutting → Complete the cutting process, 3 seconds per tray.
2、 Product parameters
项目 | 参数 |
气压 | 无 |
外形尺寸 | 1000mm × 700mm × 1600mm |
电源电压 | 220v 50HZ |
控制电压 | DC24V |
功率 | 1.5 kW |
重量 | 142KG |
适用带材 | 8-12mm PP 带（按客户要求任选） |
张力范围 | 0-35 kg，触摸屏精细可调 |
捆扎道数 | 横二道 + 竖一道 |
控制系统 | 触摸屏 + 实体按钮双操作 |
3、 Data comparison
项目 | 半自动打包机 | IC托盘专用捆扎机 |
单盘循环时间 | 30 s/盘 | 3 s/盘 |
操作员数量 | 2 | 1 |
张力精度 | 手动旋钮，波动 ±5kg | 触摸屏 0.1kg 级可调 |
粘接强度 | 易断带，粘合度不达标 | 99% 以上，稳定可靠 |
散盘报废率 | 千分之三 | 0 |
描述 | 1. 数量不达标，交期延 | 1. 自动送带收紧，张力稳定 |
4、 Product Features
1.Adopt standardized design concepts to achieve universal compatibility for non-standardized pallet bundling.
2. Specialized positioning fixture design, corresponding to the three packing slots on both sides and the middle of the JEDEC standard tray.
3. Gantry structure with two preset touchscreen modes: horizontal and vertical cutting.
4. Fine and adjustable tension (0-35kg), compatible with thin grid trays such as BGA/QFN, without damaging the chips.
5. Standard dust extraction and air suction device, with a corrugated hose interface on the machine body, suitable for dust-free workshop operating environments.
6. Reliable design and layout enhance production efficiency.
5、 Applicable scenarios
Semiconductor packaging (BGA/QFN/QFP), chip testing and aging, electronic component warehousing and shipping, AI chips/automotive specifications/MEMS and other high anti-static requirements scenarios. For packaging requirements of IC trays and chip carriers, non-standard customization is supported based on tray size, number of bundling channels, and tape specifications.
